Thermography/Thermal Expansion Testing

Providing You With The Most Insightful Data.

 

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ARAMIS 3D-DIC is the ideal tool for measuring material properties to most ASTM and ISO standards. It provides a fully automated material analysis module for fully non-contact, full-field, holistic understanding of the materials under test. Described by NASA as providing the most consistent material properties of any method, for all materials, and simple to use.

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Sample Data of Thermography/Thermal Expansion TESTING

Showing Strain of Coupon Under High Temperature
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Showing Strain of Coupon Under High Temperature
"> Showing strain of coupon under temperature
Showing Strain of Coupon Under High Temperature
High-Temperature Environmental Chamber Testing
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High-Temperature Environmental Chamber Testing
"> High-Temperature Environmental Chamber Testing using ARAMIS optical strain system
High-Temperature Environmental Chamber Testing
Motherboard Bulging from Thermal Load
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Motherboard Bulging from Thermal Load
"> ARAMIS Digital Image Correlation Thermography Data on Motherboard
Motherboard Bulging from Thermal Load