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Thermography/Thermal Expansion Testing

Providing You With The Most Insightful Data.


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ARAMIS 3D-DIC is the ideal tool for measuring material properties to most ASTM and ISO standards. It provides a fully automated material analysis module for fully non-contact, full-field, holistic understanding of the materials under test. Described by NASA as providing the most consistent material properties of any method, for all materials, and simple to use.

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Sample Data of Thermography/Thermal Expansion TESTING

Showing strain of coupon under temperature
Showing Strain of Coupon Under High Temperature
High-Temperature Environmental Chamber Testing using ARAMIS optical strain system
High-Temperature Environmental Chamber Testing
Motherboard Bulging from Thermal load
Motherboard Bulging from Thermal Load

Its your last chance!

Nah... Not really. But you knew that. Here is a nice form in case you'd like to talk to one of our team and determine what services we can provide to you and your team.