Virtual

Tuesday 11:00 - 12:00, June 30, 2020

next-generation-optical-metrology-for-sheet-metal-stamping-quality-control

 

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Event description

Knowing the properties of incoming material is crucial when working through the various phase of tool and die development. Here’s an IoT technology, optical forming analysis (OFA), developed to replace the conventional circle grid analysis (CGA), which allows operators to analyze full-field formability of a sheet metal panel. Metal formers can use the data to track die-station health during production.

 

Agenda

1. Digital Image Correlation (DIC) for Material Properties
2. Optical Forming Analysis (OFA) Patterning
3. Optical Forming Analysis (OFA) Measurement
4. Digital Image Correlation (DIC) for Press Deflection

 

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