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ARAMIS DIC (digital Image correlation) tensile testARAMIS is a powerful optical system for measurement of complex materials and structures for their 3D deformation and strain during loading. This tool is a highly robust, full-field, non-contact strain measuring testing device. The system offers a non-contact measurement of 3D deformation and strain using 3D image correlation methods (digital image correlation, DIC) using high-resolution digital CCD cameras.

The object under load is viewed by one (2D) or two (3D) high-resolution digital CCD cameras. The deformation of this structure under different load conditions is recorded by the CCD cameras and evaluated using digital image processing. The results are the 3D-coordinates, 3D displacements, the surface strain and the complete strain tensor.

Common uses include:

- Materials characterization of metallics, composites, ceramics
- Thermal Expansion Measurements
- FEM confirmation & boundary condition checking
- Fracture mechanics and Estimating stability
- Dimensioning components
- Examining non-linear deformation behavior
- Characterizing creep and aging processes
- High-speed deformation & strain measurements (see application page)

Industries served:

- Aerospace: composite & advanced material studies, structural loading studies
- Automotive: manufacturing quality analysis & FEM confirmation
- Microelectronics: thermal expansion, PCB NDT & alignments
- Composites Manufacturing:quality control, failure analysis, material & structural properties (honeycomb failure .avi)
- Metal Forming: forming limit measurements
- Biomechanics: bone & tissue strains (see application page)
- Civil Engineering: Bridges, road materials, soil loading

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Full-field strain measurement in material and component testing ARAMIS Optical 3D Deformation & Strain Measurement Trilion optical inspection systems for image correlation and material testing

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